• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method for manufacturing a flexible circuit for a module (2) for a smart card. The invention consists in using conductive pads (14) located on the same face of the module (2) as the contacts (6) intended to establish a connection with a card reader, for making an electrical connection between an antenna and a chip electronic (8). The invention also relates to a flexible circuit for implementing this method.
    公开号:FR3021145A1
    申请号:FR1454287
    申请日:2014-05-14
    公开日:2015-11-20
    发明作者:Christophe Mathieu；Bertrand Hoveman
    申请人:Linxens Holding SAS；
    IPC主号:
    专利说明:

    [0001] A method of manufacturing a chip card module circuit and a chip card module circuit. The invention relates to the field of smart cards. Smart cards are well known to the public, which has multiple uses: payment cards, SIM cards for mobile phones, transport cards, identity cards, etc. [002] The smart cards comprise transmission means for transmitting data from the chip to a card reader device (reading) or from this device to the card (writing). These transmission means can be "contact", "non-contact" or double-interface when they combine the two previous means. The invention relates in particular to the field of dual interface smart cards. Dual-interface smart cards are called "dual" if the "contact" and "contactless" modes are managed by a single chip or "hybrid" if the "contact" and "contactless" modes are managed by two physically separate chips. [003] The dual-interface smart cards generally consist of a rigid plastic support of the PVC, PVC / ABS, PET or polycarbonate type constituting the main part of the card, in which an electronic module and an electronic module are incorporated. antenna manufactured separately. The electronic module comprises a generally flexible printed circuit board equipped with an electronic chip (integrated circuit) and contact pads 20 electrically connected to the chip and flush with the electronic module, on the surface of the support, for connection by electrical contact with a device. card reader device. The dual-interface smart cards further include at least one antenna for transmitting data between the chip and a radio frequency system for contactless read / write of data. [004] In the prior art, it has often been proposed to connect the antenna to conductive pads made on the face opposite to that with the contacts. In other words, the electronic module to be inserted into a card is a so-called "double-sided" circuit, with a conductive face with the contacts and a conductive face with the conductive areas of the antenna, these two conductive faces being respectively disposed respectively on a face 30 of an insulating substrate. [5] An object of the invention is to design modules for "dual" cards more economical to manufacture. [6] For this purpose, there is provided a method of manufacturing a flexible circuit for a smart card module in which an insulating substrate and a single conductive layer 35 supported by this insulating substrate are provided. In this conductive layer, the contacts are made.
    [0002] The making of the contacts can be done by etching a sheet of electrically conductive material such as a copper alloy, previously bonded and / or laminated on the insulating substrate, with or without a layer of adhesive between the insulating substrate and the conductive layer . Alternatively, the making of the contacts can be done by cutting (so-called "leadf rame" technique according to the English terminology) contacts in a sheet of electrically conductive material such as a copper alloy, prior to its bonding and / or its lamination on the insulating substrate (also with or without adhesive layer between the insulating substrate and the conductive layer). According to this method, the insulating substrate is perforated to form connection wells.
    [0003] In the case where the contacts are etched in the conductive layer after it is carried on one of the faces of the substrate, this perforation step is advantageously carried out by punching ("punching" according to the English terminology) of the an insulating substrate before the latter receives the conductive layer.  In all cases, the conductive layer is thus ultimately supported by the insulating substrate, with a first face facing the insulating substrate and a second face for establishing a connection by electrical contact with a smart card reader.  In addition, the conductive layer at least partially covers connection wells, the first face thereof being intended to establish, at connection wells, an electrical connection with an electronic chip.  Generally, the conductive layer completely covers the connection wells to form blind holes.  But it can happen in particular that a micro-hole is made in the conductive layer at the area covering a connection well.  [001 0] At least two conductive pads, electrically insulated from the contacts, are also produced in the conductive layer at which the first face of the conductive layer at least partially closes at least one connection well intended for the connection of a electronic chip with an antenna.  [001 1] The flexible circuit chip card module thus produced therefore has only one conductive surface and saves a layer of conductive material on the other side of the insulating substrate.  Nevertheless, thanks to the conductive, separate and electrically isolated pads of the contacts intended for connection with a card reader, it is possible to connect a chip through the connection wells to an antenna.  For example, five contacts are made in the conductive layer, each respectively for the connection of the mass, the power supply, the input / output, the clock and the reset of an electronic chip. as well as two additional conductive pads.  The two additional conductive pads then each serving respectively to connect an end (or terminal) of an antenna.  The method according to the invention is particularly advantageous when it is desired to miniaturize the modules and / or its conductive pads, and in particular when it is possible to reduce the number of contacts connected to the chip.  With the method according to the invention, one can optimize the dimensions and orientation of the different conductive pads and contacts in a smart card module.  Thus, for example, two conductive pads are each made respectively substantially on either side of a central zone intended to receive the electronic chip.  Since the contacts may, in certain cases, be arranged and distributed in two rows each located respectively on either side of a central zone intended to receive the electronic chip, there may remain two zones between these two rows, to form on each one of them, a conductive beach.  We then have the two conductive pads, each respectively essentially situated on either side of the central zone intended to receive the electronic chip, with the two conductive pads and the central zone intended to receive the electronic chip distributed over a row located between the rows of contacts.  This arrangement is particularly advantageous, since in a rectangular smart card, the module can be oriented so that the two rows of contacts, each respectively disposed substantially on either side of the chip, are perpendicular to the largest dimension of the map.  Each of the ends of the antenna can then come at an edge of the module and its cavity, substantially perpendicular to the smallest side of the card.  Since, however, it is necessary to leave a space between these ends for the chip and its encapsulation resin, a connection well is made for the connection of the electronic chip with the antenna, at each of the two conductive areas, so that the distance between the wells is greater than the size of the cavity in the card to receive the chip and its encapsulation resin.  There are several ways to proceed to the connection of the chip to the antenna.  For each conductive pad can be made at least two connection wells, that is to say two connection wells separated by a portion of the insulating substrate.  On each conductive pad, one of the connection wells is used for electrical connection with the electronic chip, and the other for electrical connection with the antenna.  It is also possible to produce a single well, of sufficient size in a plane parallel to the first and second faces of the conducting layer (it is for example oblong), in order to electrically connect the microchip and the antenna in two locations on the same beach. conductive.  Advantageously, the connection is made (through a dedicated well only or not to this connection) with the electronic chip in an encapsulation zone corresponding to a zone intended to be covered by a chip protection material and its connections to the contacts and conductive pads.  Indeed, in the finished chip card module, the chip is placed on the face of the substrate opposite to that on which the conductive layer is located or in a cut-out therein, and the chip and its connections are encapsulated in a resin ("globe top" or "dam & fill" according to the English terminology, corresponding to a UV or thermal encapsulation).  The connection of each conductive pad with the antenna can be performed after this encapsulation step.  It is then performed outside the encapsulation zone through a well 10 dedicated only or not to this connection.  The steps of the method according to the invention can be carried out at the same manufacturer or at different manufacturers.  For example, the electronic chip may be attached to a smart card module circuit comprising the insulating substrate and the conductive layer, and then connected through the connection wells, both to the contacts and to the conductive pads, at an industrial site. different from the one that manufactured the circuit for smart card module (without the chip and its connections).  The connection of an antenna with a chip card module circuit supporting a chip (possibly already encapsulated in a protective resin) can be done possibly still at another manufacturer.  But it will be understood that in all cases, it is essential that the circuit (so-called "single-sided") chip card module is adapted for a connection of the chip to the antenna via the conductive layer located on the so-called face "Front face" or "face contact" of the module.  For this, as indicated above, it must comprise at least two conductive pads, electrically isolated from the contacts, at which the first face of the conductive layer at least partially closes at least one connection well intended for the connection of an electronic chip with an antenna.  In order to facilitate the module integration operations in a smart card, it can be provided that the insulating substrate consists essentially of a thermally nonretroable adhesive material.  It is considered that the material is adhesive in that it adheres to the support on which it is applied (by coating if it is in liquid form or by lamination if it is in film form).  It is also possible that the insulating substrate consists essentially of a thermally reactive adhesive material ("hot melt" according to the English terminology).  In this case, it is also adhesive in that even after coating and drying, its adhesive properties can be reactivated by heating.  The glass transition temperature Tg of the non-heat-reactive adhesive material is preferably less than 100 ° C.  It has for example a glass transition temperature Tg of the order of 50 ° C (or more generally between 40 ° C and 60 ° C).  The adhesive material is, for example, a thermoplastic modified epoxy (of the polyamide type for example).  If the adhesive material is to be coated, its viscosity is adapted so that it can be spread at room temperature over the electrically conductive layer or a removable intermediate substrate.  For example, its viscosity in the solvent phase is of the order of 80 mPa. s (more generally between 60 and 100 mPa. $).  The connection of the antenna to the conductive pads, through the connection wells, can be done in several ways: using an ink or a conductive paste 10 filling the connection wells and possibly forming an excess ("bumps" according to the English terminology) above the connection wells relative to the surface of the face of the substrate opposite to the contact face, with the aid of an ink or conductive paste forming an extra thickness on the ends of the antenna to come to establish a connection to the bottom of the connection wells, using conductive wires (gold) passing through the connection wells, etc.  It is also possible to use a substrate (possibly adhesive) with anisotropic electrical properties: electrically insulating in a plane and conducting perpendicular to this plane.  In some cases, especially when it is necessary to strengthen the attachment and / or the connection of the ends of the antenna to the conductive pads, more than two connection wells 20 are made at at least one conductive pad. .  For example, the connection wells may form a more or less regular network of holes (grid, holes arranged on concentric circles, rosette, etc.). ).  The paste, glue or conductive ink then comes to establish a mechanical anchorage and an electrical connection with the conductive pads while trapping the substrate portions left between the holes.  These multiple connection wells also make it possible to better control the diffusion and distribution of the more or less liquid conductive material (paste, ink or glue).  In another aspect, the invention relates to a flexible circuit for implementing a method of manufacturing a smart card module (or manufacturing a complete smart card) in which one uses conductive pads located on the same face of the module 30 as the contacts intended to establish a connection with a card reader, to make an electrical connection between an antenna and an electronic chip.  Thus, this flexible circuit comprises an insulating substrate whose thickness, flexibility and flexibility are compatible with, on the one hand, its implementation in a continuous coil-coil manufacturing process ("real-time"). to-reel "according to the Anglo35 Saxon terminology) and, on the other hand, with the norms and standards determining the maximum thickness of the finite chip cards.  This substrate is in the form of a sheet having a first and a second principal face substantially parallel to each other.  This dielectric substrate is generally thin.  Its thickness, advantageously less than 400 μm, is for example of the order of 20 to 200 μm, or even between 50 and 150 μm.  This substrate is, for example, a flexible film of plastic material (polyimide, PET, PEN, PVC, etc.). ) or composite material (glass-epoxy).  It can also consist of a single and single layer of adhesive whose adhesive properties are optionally reactivatable thermally (at a temperature between 130 ° C and 200 ° C).  This insulating material, possibly adhesive, may also have anisotropic conductive properties.  The insulating substrate has connection wells passing through its entire thickness in order to establish a connection between a chip located on the so-called "back" side (or "bonding sicle" in the English terminology) and contacts. and conductive pads, electrically isolated from the contacts, located on the face called "front" (or "contact sicle" in the English terminology).  The insulating substrate therefore comprises a conductive layer supported by the insulating substrate, with a first face facing the insulating substrate and a second face.  The conductive contacts and pads are formed in this conductive layer.  At the contacts, the second face of the conductive layer is intended to establish a connection by electrical contact with a smart card reader.  The first face of the conductive layer is intended to establish, at connection wells, an electrical connection with an electronic chip.  At the conductive pads, the first face of the conductive layer closes at least partially at least one connection well for connecting an electronic chip with an antenna.  With this circuit, it is possible to produce a smart card module comprising contacts that comply with the standard of the smart card and conductive pads for connection with an antenna.  This module then comprises first blind holes (connection wells at least partially closed by contacts) for the connection of the chip to the contacts and second blind holes (connection wells at least partially closed by conductive pads) for the connection from the chip to the antenna.  The connection of the antenna (in the card) to the module can be done either by third blind holes (connection wells at least partially closed by conductive pads) distinct from the second blind holes, or by the same second blind holes as those for connecting the chip to the conductive pads, or directly through an electrically conductive substrate according to its thickness and electrically insulating in a plane perpendicular to this thickness.  The mechanical fixing of the electronic chip on the substrate is carried out by at least one known technique such as chip fixing ("die-attach" according to the English terminology) and its electrical connection to the contacts and the Antenna is produced by at least one known technique, such as flip-chip technology, wire-bonding, and the like. .  Other features and advantages of the invention will appear on reading the detailed description and the accompanying drawings, in which: FIG. 1 schematically represents in perspective a smart card intended to receive a circuit for smart card according to the invention; [0031] FIG. 2 is a diagrammatic view of the front face of a circuit with contacts, this circuit being intended to produce a module for a card such as that shown in FIG. 1; - Figure 3 shows in a similar manner to Figure 2, a variant of the circuit of Figure 2; - Figure 4 shows similarly to Figure 2, a variant of the circuits of Figures 2 and 3 and its integration in a chip card cavity; [0034] FIGS. 5, 6, 7, 8 (a, b, c), 9, 10, 11 and 12 diagrammatically show in section different examples of embodiments of a circuit such as that of FIGS. 4, with its connections to a chip and an antenna, Figures 8a and 8b illustrating steps to achieve the structure shown in Figure 8c.  In this text, a zone (positioned according to the ISO 7816-2 standard and also called in this text "contact" 6) of the conductive layer 16 which may be intended for connection via contact between the chip 8 and a card reader, or a zone (also called conductive pad 14) of the conductive layer 16 which may be intended for a connection, according to the invention, from the chip to an antenna.  The conductive pads 14 thus correspond to conductive areas 17, similar to the contacts 6, 30 but which are not connected to a chip 8 for communication, by contact, with a card reader.  They can therefore be used for connection to an antenna.  As shown in Figure 1, the invention can be used for the realization of a smart card 1 (bank card type or other).  This card 1 comprises a module 2 intended to be inserted into a cavity 3, for example milled in the body of the card 1.  This module 2 comprises an electrically insulating substrate 4, advantageously flexible.  On one of the faces of this substrate 4, said front face 5, are formed in a conductive layer 16, conductive areas (that is to say contacts and conductive pads) electrically insulated from each other.  On the other so-called rear face 7, the substrate 4 supports a chip 8.  The substrate 45 with the contacts 6 and the conductive pads constitutes a metallized flexible circuit.  The conductive layer 16 is supported by the substrate 4, with a first face facing the substrate 4 and a second face for establishing a connection by electrical contact with a smart card reader (not shown).  An antenna 9 (for example Class 1 or Class 2 size according to ISO 14443-1), is inserted into the body of the card 1, between two laminated layers.  The ends 10 of this antenna 9 are accessible in the cavity 3, after milling thereof, for a connection with the chip 8.  The contacts are connected to the chip 8 with wires (not visible in FIG. 1, but shown in FIGS. 5 to 11) through connection wells 11 formed in the substrate 4.  These connection wells 11 are for example made by perforation of the substrate 4, before lamination of the conductive layer 16 with the substrate 4.  The conductive layer 16 covers at least part of the connection wells 11, the first face of the conductive layer 16 thus forming the bottom of these connection wells.  The connection wells 11 then form blind holes and allow access to the front face 5, from the rear face 7, with a single conductive layer 16 on the front face 5.  The conductive layer 16 may receive on its first and / or second face (s) various metallization layers (nickel, gold, etc.). ).  The quality of the first face (generally metallized) of the conductive layer 16 is important to ensure a good connection to the chip, for example by welding conductors son 13.  As shown diagrammatically in FIG. 2, the conductive areas 17 (whose dimensions and position are defined by the ISO 7816-2 standard) are for example eight in number (C 1, C 2, C 3, C 4, C5, C6, C7 and C8).  The simple rectangular shapes in dashed lines around the references C1 to C8 represent the minimum dimensions and the locations of the conductive zones C1 to C8 according to the ISO 7816-2 standard.  The conductive regions C1, C2, C3, C5 and C7 are still used as contacts for a connection between the chip 8 and a card reader device.  Apart from NFC applications, conductive area C6 is not used and apart from USB applications, conductive areas C4 and C8 are not used for dual-interface bank card applications.  The conductive pads 14 corresponding to the contacts C6, C4 and C8 are not, in these cases used to establish an electrical connection between the chip 8 and a card reader.  The conductive areas 04 and 08 may therefore serve, according to the invention, for the connection of the antenna 9.  Indeed, by making blind holes 12 (similar to the connection wells 11, but for example larger, oblong, etc.. ) through the substrate 4, it is possible to use two conductive pads (in this example 04 and 08) to connect the antenna 9 to the chip 8.  Different ways of making this connection are presented below in relation to FIGS. 5 to 11.  According to a variant, shown in Figure 3, the conductive areas 17 are seven in number, five contacts 6 strictly speaking and two conductive pads 14.  The surface of the conductive zone 05 is considerably reduced, the conductive zone 06 is eliminated, and more generally, the metallized conductive surfaces for making the contacts 6 and the conductive areas 14 are minimized to cover, on the one hand, essentially the minimum surfaces. required by ISO 7816-2 for conductive areas C1, 02, 03, 04, 05, 07 and 08, and on the other hand, connection wells 11 and blind holes 12.  It may be noted that the connection wells 11 and the blind holes 12 occupy the same positions as in the preceding example.  According to yet another variant shown in Figure 4, the conductive areas 17 are eight in number, including five contacts 6 strictly speaking (01, 02, 03, 05 and 07), two conductive pads 14 for connection of the antenna and the conductive zone 06 which remains unused, except for an aesthetic function).  In dashed lines are represented the connection wells 11 and the oblong holes 12, allowing the connection (schematized by the solid lines between the connection wells 11 and the chip 8) of the contacts 6 and the conductive pads 14 to the chip 8 (in FIG. rear face) through the substrate, by means of connection wires 13.  The circle corresponding to the encapsulation area 15 of the chip 8 and its connection wires 13 leaves the oblong holes 12 clear so that they can then be connected to an antenna 9.  Indeed, as shown on the right in Figure 4, the ends 10 of the antenna are discovered during milling of the cavity 3.  When inserting the module 2 in the cavity 3, the conductive areas 14 are opposite the ends 10 (see as indicated by the arrows) to be connected.  This configuration is particularly advantageous from the point of view of miniaturization, as the orientation with respect to the antenna.  Indeed, since the two conductive areas 14 are each respectively essentially on either side of a central zone intended to receive the electronic chip 8, the overall width of the module is limited essentially to that of three contacts 6 arranged and distributed in a row.  There are therefore two rows of three contacts 6, each located respectively on either side of a central zone intended to receive the electronic chip 8.  There remain two zones between these two rows, on either side of this central zone, which can be used to form the conductive pads 14.  These conductive pads 14 are opposite the ends 10 of the antenna, on either side of the cavity 3.  The connection of the conductive pads to an antenna 9 can be achieved in many ways.  FIG. 5 shows, in section, a substrate 4 with a conductive layer 16 in which contacts 6 and conductive areas 14 have been made.  A chip 8 is fixed on the face of the substrate opposite to that on which the conductive layer 16 rests.  Connection wells 11 make it possible to connect the chip 8 to the first face of the conductive layer 16 by means of connection wires 13 of the gold or copper type.  In this exemplary embodiment, the ends 10 of the antenna 9 are also connected to the first face of the conductive layer 16 by means of connection wires 13.  In this case, an antenna end 10 and the chip 8 are connected to a conductive pad 14, through a same connection well 11, possibly widened with respect to those required for the connection of the chip 8 to a contact 6. .  According to the variant illustrated in FIG. 6, an antenna end 9 and the chip 8 are connected to a conductive pad 14 through two distinct holes (for example a round connection well 11 and a hole 11). blind 12 oblong) separated by a portion of substrate 4.  According to the variant illustrated in Figure 7, replacing the wire connection of the end 10 of the antenna 9 to the conductive pad 14, by a paste, a glue or a conductive ink charged 18.  The conductive paste is for example a solder paste comprising a binary or ternary metal alloy such as AgSn, AgSnBi or AgSnCu.  The glue and the conductive ink are charged with conductive metal particles such as silver or copper.  According to the variant illustrated in FIGS. 8a to 8c, a protective support film 19 of the substrate 4 (necessary in particular in the case of a heat-reactive adhesive substrate 4) is used to form a thickening of conductive paste 18 ( fig.  8a) included, for example, between 50 and 100pm.  The protective film 19 is then removed, for example just before inserting the module, thus leaving the conductive paste 18 thicker (FIG.  8b), to facilitate the connection with an antenna end 9, when the module is integrated in the card (Fig.  8c).  The other elements of the module remain for example substantially similar to those of the variants presented above.  According to the variant illustrated in FIG. 9, the conductive paste 18 of the blind hole 12 is overflowed on the rear face of the substrate 4 so as to form, again, an extra thickness which will facilitate the connection with one end 10 antenna 9, when integrating the module in a card.  FIG. 10 schematically represents a top view of a conductive pad 14 such as that of the embodiment illustrated in FIG. 4.  Fixing and connecting the ends of the antenna to the conductive pads 14, when they are made in particular as in the embodiments illustrated in FIGS. 7 to 9, can be reinforced by using a plurality of connection wells 11.  For example, the connection wells 11 form a sort of grid through which the paste, glue or conductive ink 18 is dispensed.  Alternatively, as illustrated in FIG. 11, a blind hole 12 is left empty and without encapsulation resin, so that it can receive an antenna end 9 provided with a conductive paste overprint 18, and allowing the connection with the first face of the conductive pad 14.  According to the variant illustrated in FIG. 12, a thermally-activatable adhesive substrate 4 having anisotropic conductive properties is used.  This substrate 4 makes it possible to establish a direct electrical connection (represented by the black arrow) between an antenna end 9 and the first face of the conductive pad 14, during the press and hot inserting operation 20. .  The fact of using a substrate 4 having heat-reactive adhesive properties can directly stick the chip 8 on the substrate 4, without adding glue such as that usually used for bonding chips ("die attach") and module 2 in card 1 (see white arrow).  Advantageously, the heat-reactivatable adhesive substrate 4 is selected to be available in coils to be compatible with a continuous coil-to-coil process; - have a thermal resistance at least up to 130 ° C; [0060] have a chemical resistance to the solvents, bases and acids used in copper chemical etching processes; - Have a chemical resistance to electrolytic plating baths (nickel, gold, silver, etc.). ); Allow a gluing of the chip with a shearing force (in kgf) greater than 1.2 times the surface of the chip (in mm 2); [0063] allow ultrasonic welding of the conductive wires 13 which connect the chip 8 to the conductive layer 1 with a force greater than or equal to 3 gf; and [0064] - allow to obtain a tearing force of the module 2 after bonding in the card 1 with a force greater than or equal to 60N.  The substrates 4 compatible with these requirements correspond, for example, to references 844 or 8410 from Tesae, G185A from Scapa®, HiBond-3 from Cardele or FBML4 from Nittoe.  More generally, substrates based on co-polyamide, nitrile-phenolic, polyolefin, polyester, polyurethane, EVA, epoxy chemistry may be compatible with the invention.  The thermo-reactivatable adhesive substrate 4 may be reinforced by organic textile fibers (PET) or mineral fibers (glass) woven or non-woven in order to improve its mechanical properties during the steps of continuous scrolling.  For example, the 1080-Greige or Porcher® G106 glass fabrics can be hot-rolled continuously to form a composite substrate 4 with optimized mechanical properties.  A resin available in the form of granules, heat-coated on textile fibers using for example the technology of nozzle injection ("slot-die" according to the English terminology) can be used to obtain a substrate 4 heat-reactive adhesive.  So with this type of substrate 4, reinforced or not, we can stick the chip 8 directly above, while in the processes of the prior art a glue was to be dispensed during an additional step before integrate module 2 in card 1.  This is particularly advantageous especially when the steps of producing the module 2 on the one hand, and integrating the module 2 into a card 1, on the other hand, are performed by separate operators.  The solution of using an adhesive substrate also avoids having, on the one hand, to proceed with the coating of a layer of adhesive between a dielectric substrate of the epoxy glass type, for example, and the conductive layer. and, on the other hand, the crosslinking of this adhesive after lamination of the conductive layer on the substrate.  In addition to its heat-reactive adhesive properties, the substrate may have, as indicated above, anisotropic electrical conduction properties ("ACF" for "Anisotropic Conductive Film" according to the English terminology).  Substrates having this type of property correspond, for example, to the HAF 8412 and HAF 8414 references of Tesa® constituted respectively of phenolic and co-polyamide masses to ensure the adhesion function, and charged respectively with glass and copper microbeads coated with silver with a density of eg 60 / mm 2 to provide the electrical conduction function in the direction of the thickness of the substrate.  Substrates with anisotropic electrical conduction properties that can be used for the realization of circuits according to the invention can also be reinforced mechanically as indicated above.  The fact of reporting on a single element (the substrate 4) two functions (bonding 5 electrical connection), allows a miniaturization of the smart card modules with respect to modules in which these two functions are performed by different elements. .
    权利要求:
    Claims (23)
    [0001]
    REVENDICATIONS1. A method of manufacturing a chip card module circuit (2) (1) comprising - providing an insulating substrate (4); - perforating the insulating substrate (4) to form connection wells (11; 12), - the provision of a conductive layer (16) supported by the insulating substrate (4), with a first face facing the insulating substrate (4) and a second face, - the embodiment, in the conductive layer (16). ), contacts (6) at which o the second face is intended to establish a connection by electrical contact with a smart card reader, and o the first face is intended to establish, at connection wells (11, 12), an electrical connection with an electronic chip (8), characterized in that at least two conductive areas (14), which are electrically isolated from the contacts (6), are also made in the conductive layer (16). of which the first face of the conductive layer (16) closes at least partially at least one connection well (11, 12) for connecting the electronic chip (8) with an antenna (9).
    [0002]
    2. Method according to claim 1, wherein five contacts (6) are made in the conductive layer (16), each respectively for the connection of the mass, the power supply, the input / output, the clock. and resetting an electronic chip (8), as well as two additional conductive pads (14).
    [0003]
    3. Method according to claim 2, wherein the two conductive pads (14) are each respectively substantially on either side of a central zone for receiving the electronic chip (8).
    [0004]
    4. The method of claim 3, wherein the contacts (6) are distributed in two rows, the two conductive pads (14) and the central area for receiving the electronic chip (8) being distributed over a row located between the rows. of contacts.
    [0005]
    5. Method according to claim 2 or 3, wherein there is provided a connection well (12) for connecting the electronic chip (8) with an antenna (9) at the level of each of the two conductive pads (14), two connecting wells (12), each located respectively at a conductive pad, the distance between them being greater than the dimension of a cavity in the card for receiving the chip (8) and an encapsulating resin.
    [0006]
    6. Method according to one of the preceding claims, wherein there is provided for each conductive pad (14) at least two connection wells (11, 12), one for an electrical connection with the electronic chip (8), and the other for an electrical connection with the antenna (9).
    [0007]
    7. Method according to one of the preceding claims wherein there is provided a network of connection holes at each conductive pad.
    [0008]
    8. Method according to the preceding claim, wherein a connection well (11) is made with the electronic chip (8) in an encapsulation zone (15) corresponding to a zone intended to be covered by a protective material of the chip (5) and its connections (13) to the contacts (6) and to the conductive pads (14), and the connection well (12) is made with the antenna (9) out of the encapsulation zone ( 15). 20
    [0009]
    9. Method according to one of the preceding claims, wherein the connection wells (11, 12) at least partially closed by the conductive pads (14) have an elongated shape in a plane parallel to the first and second faces of the conductive layer. (16).
    [0010]
    10. Method according to one of the preceding claims, wherein an electronic chip (8) is attached to the assembly comprising the insulating substrate (4) and the conductive layer (16) and the chip (8) is connected, through the connection wells (11, 12) at both the contacts (6) and the conductive pads (14). 10 25 30
    [0011]
    11. Method according to one of the preceding claims, wherein the insulating substrate (4) consists essentially of an adhesive material.
    [0012]
    12. Method according to the preceding claim, wherein the adhesive material is thermally reactivatable.
    [0013]
    The method of claim 11 or 12, wherein the adhesive material has anisotropic electrical properties.
    [0014]
    14. Method according to one of the preceding claims, wherein there is carried out more than two connection wells at at least one conductive pad (14). 10
    [0015]
    15. Flexible electrical circuit for implementing a method for manufacturing a module (2) for a smart card (1), this circuit comprising: an insulating substrate (4) with connection wells, a conductive layer (16) supported by the insulating substrate (4), with a first face facing the insulating substrate (4) and a second face, with contacts (6) formed in this conductive layer (16), contacts (6) at whereof the second face is intended to establish an electrical contact connection with a chip card reader, and where the first face is intended to establish, at connection wells (11), an electrical connection with a chip electronics (8), characterized in that the conductive layer (16) also comprises at least two conductive pads (14), electrically isolated from the contacts (6), at which the first face of the conductive layer (16) closes at the least partially at least one well connector (11) for connecting an electronic chip to an antenna.
    [0016]
    16. Circuit according to claim 15, comprising five contacts (6) in the conductive layer (16), each respectively for the connection of the mass, the power supply, the input / output, the clock and the delivery. zero of an electronic chip, as well as two additional conductive pads (14) for connecting an antenna (9).
    [0017]
    17. Circuit according to one of claims 15 and 16, comprising for each conductive pad (14) at least two connection wells (11, 12), one for an electrical connection with the electronic chip (8), and the another for an electrical connection with the antenna (9).
    [0018]
    18. Circuit according to the preceding claim, comprising a connection well (11) for the connection of the antenna (9) with the electronic chip (8) in an encapsulation zone (15) covered by a protective material of the chip (8) and its connections (13) to the contacts (6) and the conductive pads (14), and a connection well (12) for connecting a conductive pad (14) to the antenna (9) out of the encapsulation zone (15).
    [0019]
    19. Circuit according to one of claims 15 to 18, comprising connecting wells (11, 12) at least partially closed each by a conductive pad (14) and whose shape is elongate in a plane parallel to the first and second faces. of the conductive layer.
    [0020]
    20. Circuit according to one of claims 15 to 19, comprising an electronic chip (8) attached to the assembly comprising the insulating substrate (4) and the conductive layer (16), this chip (8) being connected, through connecting wells (11, 12) at both the contacts (6) and the conductive pads (14).
    [0021]
    21. Circuit according to one of claims 15 to 20, wherein the insulating substrate (4) consists essentially of an adhesive material.
    [0022]
    22. Circuit according to the preceding claim, wherein the adhesive material is thermally reactivatable.
    [0023]
    The circuit of claim 21 or 22, wherein the adhesive material has anisotropic electrical properties. 20 30
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    同族专利:
    公开号 | 公开日
    EP3567527B1|2021-10-13|
    KR102069334B1|2020-02-11|
    EP3143557B1|2019-07-03|
    CN106415613B|2021-07-09|
    US20190362213A1|2019-11-28|
    CN113469320A|2021-10-01|
    FR3021145B1|2018-08-31|
    EP3143557A1|2017-03-22|
    US10810477B2|2020-10-20|
    EP3567527A1|2019-11-13|
    ES2745806T3|2020-03-03|
    CN106415613A|2017-02-15|
    KR102296702B1|2021-08-31|
    PL3143557T3|2019-11-29|
    US20170270398A1|2017-09-21|
    KR20200009135A|2020-01-29|
    KR20170033275A|2017-03-24|
    WO2015173514A1|2015-11-19|
    US10417548B2|2019-09-17|
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    法律状态:
    2015-04-22| PLFP| Fee payment|Year of fee payment: 2 |
    2015-11-20| PLSC| Search report ready|Effective date: 20151120 |
    2016-04-22| PLFP| Fee payment|Year of fee payment: 3 |
    2017-04-21| PLFP| Fee payment|Year of fee payment: 4 |
    2018-04-23| PLFP| Fee payment|Year of fee payment: 5 |
    2019-04-19| PLFP| Fee payment|Year of fee payment: 6 |
    2020-05-25| PLFP| Fee payment|Year of fee payment: 7 |
    2021-05-21| PLFP| Fee payment|Year of fee payment: 8 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1454287A|FR3021145B1|2014-05-14|2014-05-14|METHOD FOR MANUFACTURING A CIRCUIT FOR A CHIP CARD MODULE AND CIRCUIT FOR A CHIP CARD MODULE|
    FR1454287|2014-05-14|FR1454287A| FR3021145B1|2014-05-14|2014-05-14|METHOD FOR MANUFACTURING A CIRCUIT FOR A CHIP CARD MODULE AND CIRCUIT FOR A CHIP CARD MODULE|
    KR1020207001583A| KR102296702B1|2014-05-14|2015-05-13|Method for producing a circuit for a chip card module and circuit for a chip card module|
    ES15750796T| ES2745806T3|2014-05-14|2015-05-13|Manufacturing procedure of a chip card module circuit and chip card module circuit|
    KR1020167034922A| KR102069334B1|2014-05-14|2015-05-13|Method for producing a circuit for a chip card module and circuit for a chip card module|
    PL15750796T| PL3143557T3|2014-05-14|2015-05-13|Method for producing a circuit for a chip card module and circuit for a chip card module|
    PCT/FR2015/051254| WO2015173514A1|2014-05-14|2015-05-13|Method for producing a circuit for a chip card module and circuit for a chip card module|
    US15/309,904| US10417548B2|2014-05-14|2015-05-13|Method for producing a circuit for a chip card module and circuit for a chip card module|
    EP15750796.3A| EP3143557B1|2014-05-14|2015-05-13|Method for producing a circuit for a chip card module and circuit for a chip card module|
    CN201580031910.9A| CN106415613B|2014-05-14|2015-05-13|Method for producing a circuit for a chip card module and circuit for a chip card module|
    EP19183469.6A| EP3567527B1|2014-05-14|2015-05-13|Method of manufacturing a circuit for chip-card module and circuit for chip-card module|
    CN202110823018.1A| CN113469320A|2014-05-14|2015-05-13|Method for producing a circuit for a chip card module and circuit for a chip card module|
    US16/519,579| US10810477B2|2014-05-14|2019-07-23|Method for producing a circuit for a chip card module and circuit for a chip card module|
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